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    APU1C heat

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    • D
      drclaw
      last edited by

      Yeah maybe.

      I don't normally use thermal pads, i've always had better luck with high quality thermal paste personally. If I cut a hole in the side i'd get rid of the 2x thermal pads, and have one big heatsink with a thin layer of good paste… not sure how i'd stick the sucker on, i'd prefer not to use thermal apoxy heh :)

      Just throwing around ideas at this stage :)

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      • stephenw10S
        stephenw10 Netgate Administrator
        last edited by

        @gonzopancho:

        moving air across the case is likely to help more

        Yes, I should have said; while remaining a passive cooling solution.

        @drclaw I've never been a fan of those thermal pads either. Every laptop with a toasted graphics chip I've looked in seemed to be using one. I've replaced a few with copper shims before but you have to get the thickness and placement perfect.

        Steve

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        • B
          bennyc
          last edited by

          Now my Alix is back in use, got to 2.2 through usb boot. And surprise-surprise: we have a working thermal sensor  8)
          Seems my cpu is hoovering round 51-52°C, and that is without added heatsinks (not arrived yet…. patience is a virtue)
          This is without much load (almost none), and PowerD not activated. It tends to go up rather fast when asking actions from the system (packages, configuration changes in the gui, ...) but equally drops pretty fast. (good thing, means the heat gets dissipated ;))
          I activated PowerD for testing (as quoted by drclaw), but doesn't seem to make much difference when there's not much going on (seems logic)
          I'll report back when those chinese heatsinks are mounted.....

          ps: enjoying the 103% disk usage here !  (I always love it when a system gives me more than it should ;D)

          2.2alpha.JPG
          2.2alpha.JPG_thumb

          4x XG-7100 (2xHA), 1x SG-4860, 1x SG-2100
          1x PC Engines APU2C4, 1x PC Engines APU1C4

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